• DocumentCode
    3486523
  • Title

    Minimizing the energy cost of throughput in a linear pipeline by opportunistic time borrowing

  • Author

    Ghasemazar, Mohammad ; Pedram, Massoud

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA
  • fYear
    2008
  • fDate
    10-13 Nov. 2008
  • Firstpage
    155
  • Lastpage
    160
  • Abstract
    In this paper, we present a technique to optimize the energy-delay product of a synchronous linear pipeline circuit with dynamic error detection and correction capability running. The technique dynamically adjusts the supply voltage level and clock frequency of the design by exploiting slacks that are present in various stages of the pipeline. The key enabler is the utilization of soft-edge flip-flops to allow time borrowing between consecutive stages of the pipeline in order to provide the timing-critical stages with more time to complete their computations resulting in lower error probability. This raises the effective throughput of the pipeline for a fixed energy consumption level, or alternatively, lowers the energy consumption for the same effective throughput. We formulate the problem of optimally selecting the transparency window sizes of the soft-edge flip-flops and the frequency level of the pipeline circuit at different voltage levels so as to optimize the energy cost of the achieved throughput. Experimental results show the efficacy of the problem formulation and solution technique.
  • Keywords
    error correction; error detection; error statistics; flip-flops; logic design; energy consumption level; energy-delay product; error correction capability; error detection capability; error probability; soft-edge flip-flops; synchronous linear pipeline circuit; transparency window sizes; Circuits; Clocks; Costs; Energy consumption; Error correction; Flip-flops; Frequency; Pipelines; Throughput; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-2819-9
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2008.4681567
  • Filename
    4681567