DocumentCode
3486663
Title
Guiding global placement with wire density
Author
Tsota, Kalliopi ; Koh, Cheng-Kok ; Balakrishnan, Venkataramanan
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
fYear
2008
fDate
10-13 Nov. 2008
Firstpage
212
Lastpage
217
Abstract
This paper presents an efficient technique for the estimation of the routed wirelength during global placement using the wire density of the net. The proposed method identifies congested regions of the chip and incorporates the model of the routed wirelength into the objective function in order to effectively alleviate these regions from congestion. The method is integrated in the analytical placement framework and the two-level structure improves the scalability of the placer and speeds up the algorithm. The proposed analytical placer provides the best-so-far average routed wirelength in the IBM version2 benchmark suite.
Keywords
VLSI; integrated circuit design; network routing; IBM version2 benchmark suite; VLSI physical design; objective function; routed wirelength estimation; wire density; Algorithm design and analysis; Circuits; Clustering algorithms; Minimization; Phased arrays; Pins; Routing; Scalability; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-4244-2819-9
Electronic_ISBN
1092-3152
Type
conf
DOI
10.1109/ICCAD.2008.4681576
Filename
4681576
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