• DocumentCode
    3486783
  • Title

    System-level thermal aware design of applications with uncertain execution time

  • Author

    Zhang, Sushu ; Chatha, Karam S.

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Arizona State Univ., Tempe, AZ
  • fYear
    2008
  • fDate
    10-13 Nov. 2008
  • Firstpage
    242
  • Lastpage
    249
  • Abstract
    The paper introduces the problem of system-level thermal aware design of applications with uncertain run time on an embedded processor equipped with dynamic voltage/frequency scaling features. The problem takes as inputs a task sequence, cycle time distribution of each task, and processor thermal model. The solution specifies a voltage/frequency assignment to the tasks such that the expected latency is minimized subject to the probability that the peak temperature constraint is not violated is no less than a designer specified value. We prove that the problem is at least NP-hard, and present optimal and (1 + epsi) fully polynomial time approximation scheme as solutions. To the best of our knowledge, this paper is the first work that addresses the stochastic version of the system-level thermal-aware design problem. We evaluate the effectiveness of our techniques by experimenting with realistic and synthetic benchmarks.
  • Keywords
    circuit CAD; computational complexity; embedded systems; integrated circuit design; optimisation; polynomial approximation; stochastic processes; thermal analysis; uncertain systems; embedded processor; polynomial time approximation; stochastic version; system-level thermal aware design; uncertain run time; Clocks; Delay; Dynamic voltage scaling; Embedded system; Frequency; Microprocessors; Polynomials; Power system management; Temperature; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-2819-9
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2008.4681581
  • Filename
    4681581