Application of dielectric isolation technology based on soot bonding

Author

Sawada, R. ; Nakada, H.

Author_Institution

NTT Appl. Electron. Lab., Tokyo, Japan

fYear

1991

fDate

22-24 Apr 1991

Firstpage

203

Lastpage

208

Abstract

A soot bonding method has been developed that solves the economic and limited-diameter problems associated with the conventional dielectrically isolated substrate. In this method, the Si-B-O soot particles used as adhesive agents are generated by essentially the same flame-hydrolysis technology used for fabricating optical waveguides. This soot bonding method is effective even for joining a surface with deep V-grooves or trenches, as well as for rough poly-Si-deposited surfaces. The ability to bond substrates with any joining surface conditions is expected to lead to wide application of this process and to a reduction of the steps, resulting in cost reduction

Keywords

integrated circuit technology; large scale integration; surface treatment; deep V-grooves; deep trenches; dielectric isolation technology; flame-hydrolysis technology; joining surface conditions; limited-diameter problems; polysilicon-deposited surfaces; soot bonding; Bonding; Costs; Dielectric substrates; Glass; Isolation technology; Optical surface waves; Rough surfaces; Surface roughness; Thermal conductivity; Vitrification;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs, 1991. ISPSD '91., Proceedings of the 3rd International Symposium on

Conference_Location

Baltimore, MD

ISSN

1063-6854

Print_ISBN

0-7803-0009-2

Type

conf

DOI

10.1109/ISPSD.1991.146100

Filename

146100