DocumentCode :
3487727
Title :
FBT: Filled Buffer Technique to reduce code size for VLIW processors
Author :
Bonny, Talal ; Henkel, J-öorg
Author_Institution :
Dept.for Embedded Syst., Univ. of Karlsruhe, Karlsruhe
fYear :
2008
fDate :
10-13 Nov. 2008
Firstpage :
549
Lastpage :
554
Abstract :
VLIW processors provide higher performance and better efficiency etc. than RISC processors in specific domains like multimedia applications etc. A disadvantage is the bloated code size of the compiled application code. Therefore, reducing the application code size is a design key issue for VLIW processors. In this paper we adapt a hardware-supported approach called ldquoDeflaterdquo which has been used before in data compression. It can significantly reduce the code size compared to state-of-the-art approaches for VLIW processors as we will show within this work. In fact, we enhance the ldquoDeflaterdquo algorithm by using a new technique called Filled Buffer Technique which can be applied to any Lempel-Ziv family algorithms to improve compression ratio in average by more than 13% compared to the sole ldquoDeflaterdquo algorithm. Using our Filled Buffer Technique in conjunction with ldquoV2Frdquo improves the compression ratio by 10%. We have conducted evaluations using a representative set of benchmarks (from Mediabench and Mibench) and have applied our scheme to two VLIW processors, namely TMS320C62x and TMS320C64x. We achieved allover compression ratios as low as 44% using the ldquoDeflaterdquo algorithm (61% and 56% in average for TMS320C62x and TMS320C64x, respectively).
Keywords :
data compression; multiprocessing systems; Deflate algorithm; Lempel-Ziv family algorithms; TMS320C62x; TMS320C64x; VLIW processors; compression ratio; filled buffer technique; hardware-supported approach; Data compression; Decoding; Embedded system; Encoding; Flyback transformers; Multimedia systems; Reduced instruction set computing; Silicon; Throughput; VLIW;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
ISSN :
1092-3152
Print_ISBN :
978-1-4244-2819-9
Electronic_ISBN :
1092-3152
Type :
conf
DOI :
10.1109/ICCAD.2008.4681629
Filename :
4681629
Link To Document :
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