• DocumentCode
    3488
  • Title

    Dual-Sweep Combinational Transconductance Technique for Separate Extraction of Parasitic Resistances in Amorphous Thin-Film Transistors

  • Author

    Sungwoo Jun ; Hagyoul Bae ; Hyeongjung Kim ; Jungmin Lee ; Sung-Jin Choi ; Dae Hwan Kim ; Dong Myong Kim

  • Author_Institution
    Sch. of Electr. Eng., Kookmin Univ., Seoul, South Korea
  • Volume
    36
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    144
  • Lastpage
    146
  • Abstract
    We report a dual-sweep combinational transconductance technique for separate extraction of parasitic source (RS) and drain (RD) resistances in thin-film transistors (TFTs) by combining forward and reverse transfer characteristics. In the proposed technique, gate bias-dependent total resistance [RTOT (VGS)] and degradation of the transconductance due to the parasitic resistance at the source terminal during the dual-sweep characterization are employed. Applying the proposed technique to amorphous oxide semiconductor TFTs with various combinations of channel length (L) and width (W), we successfully separated RS and RD. A model for the W- and L-dependences of the extracted parasitic resistances is also provided.
  • Keywords
    amorphous semiconductors; indium compounds; semiconductor device models; thin film transistors; InGaZnO; amorphous thin film transistors; drain resistance extraction; dual-sweep combinational transconductance technique; forward transfer characteristics; gate bias dependent total resistance; parasitic resistance extraction; reverse transfer characteristics; source terminal; transconductance degradation; Capacitance; Degradation; Electrical resistance measurement; Logic gates; Resistance; Thin film transistors; Transconductance; Drain resistance; Dual-sweep; Parasitic resistance; Source resistance; TFT; Thin film transistors; drain resistance; dual-sweep; source resistance; thin film transistors;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2384504
  • Filename
    7001587