Bond-based design for MMW CMOS circuit optimization

In this paper, the bond-based design was proposed to suppress the discrepancy between results obtained by the circuit analysis and layout in the MMW CMOS. In the bond-based design, TLs are used in the target circuit to avoid wiring effect. We also presented a PREMICS that optimizes MMW LNAs and generates corresponding layout. To efficiently analyze circuit including the TL, network analysis based on S parameter calculation is adopted. To reduce the calculation time, table model is utilized for each device. As a result, the PREMICS with the bond-based design is expected to increase the productivity of high-performance MMW CMOS circuits by reducing their development time.