DocumentCode :
3488180
Title :
Process variability-aware transient fault modeling and analysis
Author :
Chopra, K. ; Cheng Zhuo ; Blaauw, D. ; Sylvester, Dennis
Author_Institution :
Electr. & Comput. Eng. Dept., Carnegie Mellon Univ., Pittsburgh, PA
fYear :
2008
fDate :
10-13 Nov. 2008
Firstpage :
685
Lastpage :
690
Abstract :
Due to reduction in device feature size and supply voltage, the sensitivity of digital systems to transient faults is increasing dramatically. As technology scales further, the increase in transistor integration capacity also leads to the increase in process and environmental variations. Despite these difficulties, it is expected that systems remain reliable while delivering the required performance. Reliability and variability are emerging as new design challenges, thus pointing to the importance of modeling and analysis of transient faults and variation sources for the purpose of guiding the design process. This work presents a symbolic approach to modeling the effect of transient faults in digital circuits in the presence of variability due to process manufacturing. The results show that using a nominal case and not including variability effects, can underestimate the SER by 5% for the 50% yield point and by 10% for the 90% yield point.
Keywords :
Monte Carlo methods; electric breakdown; integrated circuit reliability; monolithic integrated circuits; Monte Carlo simulation; chip level gate oxide breakdown analysis; die-to-die components; distinct random variable; full-chip gate-oxide reliability analysis; integrated circuit; transformation; within-die components; Circuit faults; Electromagnetic transients; Error analysis; Logic circuits; Manufacturing processes; Process design; Propagation delay; Semiconductor process modeling; Transient analysis; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
ISSN :
1092-3152
Print_ISBN :
978-1-4244-2819-9
Electronic_ISBN :
1092-3152
Type :
conf
DOI :
10.1109/ICCAD.2008.4681651
Filename :
4681651
Link To Document :
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