Title :
Microwave operation of on-chip antenna embedded in WL-CSP [RFID applications]
Author :
Abe, Hiroshi ; Sato, Masakazu ; Itoi, Kazuhisa ; Kawai, Shiekazu ; Tanak, Tsutomu ; Hayashi, Toshiharu ; Saitoh, Yutaka ; Ito, Tatsuya
Author_Institution :
Electron Device Lab., Fujikura Ltd., Tokyo, Japan
Abstract :
An on-chip antenna for microwave operation is demonstrated. The application of wafer-level chip-scale package (WL-CSP) techniques such as dual Cu electroplating conductive layers, and thick resin layers separating the conductive layer more than 10 μm from the Si substrate, allow on-chip integration. Details of the antenna fabrication process and performance are presented. Antenna performance achieved a maximum communication range between the on-chip antenna and a transmission module of over 400 mm at a transmission signal power of 300 mW. WL-CSP techniques realize real chip-scale long communication range radio frequency identification (RFID) tags.
Keywords :
chip scale packaging; copper; electroplating; microwave antennas; radiofrequency identification; resins; spiral antennas; 10 micron; 300 mW; 400 mm; Cu; RFID tag; WL-CSP embedded antenna; electroplated conductive layers; maximum communication range; microwave on-chip antenna; radio frequency identification tag; swirl type antenna; thick resin separating layers; wafer-level chip-scale package; Copper; Costs; Fabrication; Microwave antennas; Packaging; RFID tags; Radiofrequency identification; Resins; Transmitting antennas; Wafer scale integration;
Conference_Titel :
Antenna Technology: Small Antennas and Novel Metamaterials, 2005. IWAT 2005. IEEE International Workshop on
Print_ISBN :
0-7803-8842-9
DOI :
10.1109/IWAT.2005.1461031
