Title :
Modeling and simulation for on-chip power grid networks by locally dominant Krylov subspace method
Author :
Yan, Boyuan ; Tan, Sheldon X -D ; Chen, Gengsheng ; Wu, Lifeng
Author_Institution :
Dept. of Electr. Eng., Univ. of California, Riverside, CA
Abstract :
Fast analysis of power grid networks has been a challenging problem for many years. The huge size renders circuit simulation inefficient and the large number of inputs further limits the application of existing Krylov-subspace macromodeling algorithms. However, strong locality has been observed that two nodes geometrically far have very small electrical impact on each other because of the exponential attenuation. However, no systematic approaches have been proposed to exploit such locality. In this paper, we propose a novel modeling and simulation scheme, which can automatically identify the dominant inputs for a given observed node in a power grid network. This enables us to build extremely compact models by projecting the system onto the locally dominant Krylov subspace corresponding to those dominant inputs only. The resulting simulation can be very fast with the compact models if we only need to view the responses of a few nodes under many different inputs. Experimental results show that the proposed method can have at least 100X speedup over SPICE-like simulations on a number of large power grid networks up to 1 M nodes.
Keywords :
SPICE; VLSI; circuit simulation; integrated circuit modelling; power grids; Krylov-subspace macromodeling algorithms; SPICE-like simulations; VLSI systems; circuit simulation; exponential attenuation; locally dominant Krylov subspace method; on-chip power grid network modelling; Application specific integrated circuits; Attenuation; Circuit analysis; Filters; Microelectronics; Network-on-a-chip; Power grids; Power system modeling; System-on-a-chip; Transfer functions;
Conference_Titel :
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2819-9
Electronic_ISBN :
1092-3152
DOI :
10.1109/ICCAD.2008.4681659