Title :
Using test data to improve IC quality and yield
Author_Institution :
IBM Res., Austin Res. Lab., Austin, TX
Abstract :
The complexity of interactions in todaypsilas manufacturing processes makes test structures and experiments inadequate as sole drivers of yield-learning and design-for-manufacturing [DfM]. They must be driven by product impact. Product-impact-oriented test-based learning provides insight into the nature of model-hardware mismatches and variability that exist on and impact real products. That insight can be used to drive both parametric and defect-oriented process actions and DfM.
Keywords :
design for manufacture; integrated circuit testing; integrated circuit yield; design-for-manufacturing; integrated circuit quality; integrated circuit yield; model-hardware mismatches; product-impact-oriented test; test data; Circuit testing; Design for manufacture; FETs; Frequency; Integrated circuit testing; Manufacturing processes; Packaging; Power measurement; Process design; Semiconductor device modeling;
Conference_Titel :
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2819-9
Electronic_ISBN :
1092-3152
DOI :
10.1109/ICCAD.2008.4681663
