Performance evaluation of fully embedded board level optical interconnection

Author

Choi, Jinho ; Wang, Li ; Wang, Xiaolong ; Hass, David ; Magera, Jerry ; Chen, Ray T.

Author_Institution

Texas Univ., Austin, TX, USA

fYear

2004

fDate

28-30 June 2004

Firstpage

9

Lastpage

10

Abstract

We have made a thin flexible waveguide film for fully embedded board level optical interconnections. First, the master waveguide structures are formed on a silicon wafer using a standard photolithography process. Two 12-channel, 850 nm VCSEL arrays (2.5 Gb/s and 10 Gb/s) and a PIN photodiode array are used as I/O sources on a flexible polymeric waveguide film. The initial substrate thickness (200 μm) of the VCSEL is reduced to facilitate thermal management of the VCSEL and the fully embedded structure.

Keywords

elemental semiconductors; optical arrays; optical films; optical interconnections; optical polymers; optical waveguides; optoelectronic devices; photolithography; silicon; surface emitting lasers; 10 Gbit/s; 2.5 Gbit/s; 200 micron; 850 nm; PIN photodiode array; Si; VCSEL arrays; fully embedded board level optical interconnection; silicon wafer; standard photolithography process; thin flexible waveguide film; Lithography; Optical films; Optical interconnections; Optical waveguides; PIN photodiodes; Polymer films; Silicon; Substrates; Thermal management; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004 Digest of the LEOS Summer Topical Meetings

ISSN

1099-4742

Print_ISBN

0-7803-8306-0

Type

conf

DOI

10.1109/LEOSST.2004.1338679

Filename

1338679