Title :
Heterogeneous integration of III-V membrane devices and ultracompact SOI waveguides
Author :
Roelkens, G. ; Vanthourhout, D. ; Baets, R.
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
Abstract :
In this paper we focus on the heterogeneous integration of III-V opto-electronic devices and ultracompact SOI waveguides. The bonding coupling scheme of III-V and SOI is proposed. The first design is based on a thin film spin-on glass (SOG) adhesive bonding layer. Bonding layer thickness below 0.5 μm have been presented. The second design is based on a thick film benzocyclobutene bonding (BCB). Bonding layer thickness above 1 μm is readily achievable.
Keywords :
III-V semiconductors; adhesive bonding; integrated optics; integrated optoelectronics; optical couplers; optical films; optical glass; optical polymers; optical waveguides; silicon-on-insulator; BCB bonding; III-V membrane device; III-V opto-electronic device; SOG bonding layer; bonding coupling scheme; bonding layer thickness; heterogeneous integration; thick film benzocyclobutene bonding; thin film spin-on glass adhesive bonding layer; ultracompact SOI waveguide; Biomembranes; Bonding; CMOS technology; III-V semiconductor materials; Indium phosphide; Integrated optics; Optical films; Optical waveguides; Semiconductor waveguides; Silicon on insulator technology;
Conference_Titel :
Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004 Digest of the LEOS Summer Topical Meetings
Print_ISBN :
0-7803-8306-0
DOI :
10.1109/LEOSST.2004.1338686
