• DocumentCode
    3488625
  • Title

    Energy-efficient fault tolerance in chip multiprocessors using Critical Value Forwarding

  • Author

    Subramanyan, Pramod ; Singh, Virendra ; Saluja, Kewal K. ; Larsson, Erik

  • Author_Institution
    Indian Inst. of Sci., Bangalore, India
  • fYear
    2010
  • fDate
    June 28 2010-July 1 2010
  • Firstpage
    121
  • Lastpage
    130
  • Abstract
    Relentless CMOS scaling coupled with lower design tolerances is making ICs increasingly susceptible to wear-out related permanent faults and transient faults, necessitating on-chip fault tolerance in future chip microprocessors (CMPs). In this paper we introduce a new energy-efficient fault-tolerant CMP architecture known as Redundant Execution using Critical Value Forwarding (RECVF). RECVF is based on two observations: (i) forwarding critical instruction results from the leading to the trailing core enables the latter to execute faster, and (ii) this speedup can be exploited to reduce energy consumption by operating the trailing core at a lower voltage-frequency level. Our evaluation shows that RECVF consumes 37% less energy than conventional dual modular redundant (DMR) execution of a program. It consumes only 1.26 times the energy of a non-fault-tolerant baseline and has a performance overhead of just 1.2%.
  • Keywords
    CMOS integrated circuits; fault tolerant computing; multiprocessing systems; CMOS scaling; CMP; chip multiprocessors; critical value forwarding; dual modular redundant program execution; energy efficient fault tolerance; on-chip fault tolerance; permanent faults; redundant execution using critical value forwarding; transient faults; Energy consumption; Energy efficiency; Fault detection; Fault tolerance; Fault tolerant systems; Hardware; Microprocessors; Power dissipation; Proposals; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dependable Systems and Networks (DSN), 2010 IEEE/IFIP International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-7500-1
  • Electronic_ISBN
    978-1-4244-7499-8
  • Type

    conf

  • DOI
    10.1109/DSN.2010.5544918
  • Filename
    5544918