Title :
High performance 70nm gate length Germanium-On-Insulator pMOSFET with high- /metal gate
Author :
Romanjek, K. ; Hutin, L. ; Le Royer, C. ; Pouydebasque, A. ; Jaud, M.-A. ; Tabone, C. ; Augendre, E. ; Sanchez, L. ; Hartmann, J. -M ; Grampeix, H. ; Mazzocchi, V. ; Soliveres, S. ; Truche, R. ; Clavelier, L. ; Scheiblin, P. ; Garros, X. ; Reimbold, G. ;
Author_Institution :
CEA-LETI, MINATEC, Grenoble
Abstract :
We demonstrate for the first time 70 nm gate length TiN/HfO2 pMOSFETs on 200 mm GeOI wafers, with excellent performances: ION=330 muA/mum & IOFF=1 muA/mum @ Vd=-1.2 V (without germanide). These performances are obtained using adapted counterdoping and pocket implants. We report the best CV/I vs. IOFF trade-off for Ge or GeOI: CV/I=4.4 ps, IOFF=500 nA/mum @ Vd=-1 V. Moreover, based on fine electrical characterizations (mu, Dit, Raccess) at T=77-300 K, in-depth analysis of both ON & OFF states were carried out. Besides, calibrated TCAD simulations were performed to predict the performance enhancements which can be theoretically reached after further device optimization. By using germanide and reducing both interface state density and diode leakage we expect ION=450 muA/mum, IOFF=100 nA/mum @ Vd=-1 V for Lg=70 nm.
Keywords :
doping; germanium; hafnium compounds; interface states; power MOSFET; titanium compounds; ON-OFF states; TiN-HfO2-Ge; counterdoping; diode leakage; gate length germanium-on-insulator pMOSFET; high metal gate; interface state density; pocket implants; size 200 mm; size 70 nm; temperature 77 K to 300 K; Doping; Etching; Hafnium oxide; Implants; Light emitting diodes; MOSFET circuits; Predictive models; Silicon; Tin; Tunneling;
Conference_Titel :
Solid-State Device Research Conference, 2008. ESSDERC 2008. 38th European
Conference_Location :
Edinburgh
Print_ISBN :
978-1-4244-2363-7
Electronic_ISBN :
1930-8876
DOI :
10.1109/ESSDERC.2008.4681702