A mixture distribution for the wire bonding image

Author

Noor, Norliza Mohd ; Rijal, Omar Mohd ; Badar, Omar Mohd ; Thon, P´ng Yik

Author_Institution

Diploma Program, Univ. Teknologi, Kuala Lumpur, Malaysia

Volume

2

fYear

2001

fDate

2001

Firstpage

655

Abstract

As a measure of quality for wire bonding, the degree of formation of intermetallics between gold ball and aluminium bond pad was estimated. A digital colour circle image of the surface of the gold ball that was attached to the bond pad was obtained. The resultant image had to be modelled by a three component mixture model proposed by Noor, Rijal, Badar and Thon, (see IEEE TENCON 2000, Kuala Lumpur, p.1299-1304, September 2000), but was shown to be a bad fit. We show that digitizing the polygon image in grey level resulted in a simpler image histogram, which could be model by a two-component mixture model. As an additional method of determining cut-off points between the ´humps´ in the mixture model, line profiles of the image were studied

Keywords

image processing; lead bonding; statistical analysis; AuAl; aluminium bond pad; cut-off points; digital colour circle image; gamma components; gold ball; grey level; humps; image histogram; intermetallics; line profiles; mixture distribution; polygon image; three component mixture model; two-component mixture model; wire bonding image; Bonding; Gold; Histograms; Intermetallic; MATLAB; Mathematical model; Parameter estimation; Pixel; Signal processing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Processing and its Applications, Sixth International, Symposium on. 2001

Conference_Location

Kuala Lumpur

Print_ISBN

0-7803-6703-0

Type

conf

DOI

10.1109/ISSPA.2001.950230

Filename

950230