Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions

This paper presented an efficient method to extract the interconnection parasitic elements in 3-D packaging. The use of the MPIE with the global basis functions enables automatic generation of the equivalent circuit, complexity of which can be controlled by the defined model bandwidth. The proposed method is well applied several interconnection examples, and can be extended to modeling practical problems containing large number of interconnections.