Title :
Front and back gate interface-trap generation due to hot carrier stress in fully depleted SOI/MOSFETs
Author :
Li, Yujun ; Ma, T.P.
Author_Institution :
Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
Abstract :
The analysis of hot-carrier induced degradation of SOI/MOSFETs is a complicated problem due to the dual channel and front-back coupling effect. Opinions vary as to whether hot-carrier stress of the front (or back) channel results in damage of the opposite channel. Most of the previous studies have used channel current or transconductance as the monitor of hot-carrier induced degradation in SOI/MOSFETs, which often does not allow clear separation between interface-trap generation and charge trapping at both interfaces. In this paper, by systematically examining the charge-pumping currents, junction recombination currents, static Id-Vg characteristics, and transconductance curves, we will demonstrate that the opposite channel is indeed damaged during channel hot-carrier (HC) stress, and this damage can be separated from the front-back coupling effect
Keywords :
MOSFET; electron traps; electron-hole recombination; hot carriers; semiconductor device reliability; silicon-on-insulator; charge-pumping currents; dual channel coupling effect; front-back coupling effect; fully depleted SOI/MOSFETs; hot carrier stress; hot-carrier induced degradation; interface-trap generation; junction recombination currents; static Id-Vg characteristics; transconductance curves; Charge measurement; Charge pumps; Current measurement; Degradation; Electron traps; Hot carrier effects; Hot carriers; MOSFETs; Stress; Transconductance;
Conference_Titel :
SOI Conference, 1995. Proceedings., 1995 IEEE International
Conference_Location :
Tucson, AZ
Print_ISBN :
0-7803-2547-8
DOI :
10.1109/SOI.1995.526457