• DocumentCode
    3490079
  • Title

    CMOS compatible Gate-All-Around Vertical silicon-nanowire MOSFETs

  • Author

    Yang, B. ; Buddharaju, K.D. ; Teo, S.H.G. ; Fu, J. ; Singh, N. ; Lo, G.Q. ; Kwong, D.L.

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore
  • fYear
    2008
  • fDate
    15-19 Sept. 2008
  • Firstpage
    318
  • Lastpage
    321
  • Abstract
    We present vertical gate-all-around (GAA) silicon nanowire transistors on bulk silicon wafer utilizing fully CMOS compatible technology. High aspect ratio (up to 50:1) vertical nanowires with diameter down to ~ 20 nm are achieved from lithography and dry-etch defined Si-pillars with subsequent oxidation. The surrounding gate length is controlled using etch back of the sacrificial oxide. n- and p-MOS devices thus fabricated with gate length ~ 120 nm to 150 nm showed excellent transistor characteristics with large drive current per wire, high Ion/Ioff ratio (~ 107), good subthreshold slope (~ 80 mV/dec) and low DIBL (~ 20 mV/ V). Along with good electrical characteristics, the use of low cost bulk wafers, and simple gate definition process steps could make this device a suitable candidate for next generation technology nodes.
  • Keywords
    MOSFET; nanoelectronics; nanolithography; nanowires; oxidation; CMOS compatible technology; MOSFET; aspect ratio; gate length; gate-all-around silicon nanowire transistors; lithography; oxidation; CMOS technology; Fabrication; MOSFETs; Microelectronics; Nanoscale devices; Oxidation; Silicon; Transistors; Wet etching; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 2008. ESSDERC 2008. 38th European
  • Conference_Location
    Edinburgh
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4244-2363-7
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2008.4681762
  • Filename
    4681762