Durability modelling of a BGA component under random vibration

This study introduces a computation method to assess damage in electronic solder joints under random vibration. It addresses full 3D dynamic behaviour of electronic board. Finite element modelling (FEM) of electronic BGA (ball grid array) and CGA (column grid array) packages assemblies are developed and adjusted with experimental modal identification of the test board. Vibration FEM simulations are performed to calculate stress transfer functions of critical solder joints. Then, solder joint time-stress responses due to an input random excitation of the board are generated. Stress range distributions are established from rainflow counting. Finally, linear damage computation is done and compared with experimental results by using an empirical damage law. The potential and the limitation of this method are discussed.