• DocumentCode
    3490239
  • Title

    Use the reverse engineering technique to link COMSOL and ANSYS softwares

  • Author

    Achkar, Hikmat ; Pennec, Fabienne ; Peyrou, David ; Sartor, Marc ; Plana, Robert ; Pons, Patrick

  • Author_Institution
    LAAS-CNRS, Toulouse
  • fYear
    2008
  • fDate
    20-23 April 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    To simulate different topologies of deformable micro structures, some multiphysics softwares that forms our simulation platform are under investigation. The criteria for weighing the software is the precision of the results with an acceptable time of calculation to simulate different models with multiple variables. The existance of COMSOL 3.3, at a time linking all the physics and having a good interactive interface seemed to be a good solution. Being new, and under development, COMSOL 3.3 needed to be valid on different points and specialy needs to be linked to another software to complete what COMSOL cannot do. As a first step, we validated the numerical platform by comparing results of different softwares and also some analytical solutions. The basic advantages and drawbacks of each software were considered then we have developed a method to link COMSOL and ANSYS since we think they are complementary. In terms of time of calculation, an interesting result concerning the speed of COMSOL to solve the problem when compared to ANSYS, while keeping the same precision of calculation.
  • Keywords
    digital simulation; electronic engineering computing; micromechanical devices; ANSYS software; COMSOL software; deformable microstructures; multiphysics softwares; reverse engineering technique; Analytical models; Application software; Contacts; Deformable models; Geometry; Micromechanical devices; Physics; Reverse engineering; Solid modeling; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
  • Conference_Location
    Freiburg im Breisgau
  • Print_ISBN
    978-1-4244-2127-5
  • Electronic_ISBN
    978-1-4244-2128-2
  • Type

    conf

  • DOI
    10.1109/ESIME.2008.4525052
  • Filename
    4525052