DocumentCode
3490239
Title
Use the reverse engineering technique to link COMSOL and ANSYS softwares
Author
Achkar, Hikmat ; Pennec, Fabienne ; Peyrou, David ; Sartor, Marc ; Plana, Robert ; Pons, Patrick
Author_Institution
LAAS-CNRS, Toulouse
fYear
2008
fDate
20-23 April 2008
Firstpage
1
Lastpage
5
Abstract
To simulate different topologies of deformable micro structures, some multiphysics softwares that forms our simulation platform are under investigation. The criteria for weighing the software is the precision of the results with an acceptable time of calculation to simulate different models with multiple variables. The existance of COMSOL 3.3, at a time linking all the physics and having a good interactive interface seemed to be a good solution. Being new, and under development, COMSOL 3.3 needed to be valid on different points and specialy needs to be linked to another software to complete what COMSOL cannot do. As a first step, we validated the numerical platform by comparing results of different softwares and also some analytical solutions. The basic advantages and drawbacks of each software were considered then we have developed a method to link COMSOL and ANSYS since we think they are complementary. In terms of time of calculation, an interesting result concerning the speed of COMSOL to solve the problem when compared to ANSYS, while keeping the same precision of calculation.
Keywords
digital simulation; electronic engineering computing; micromechanical devices; ANSYS software; COMSOL software; deformable microstructures; multiphysics softwares; reverse engineering technique; Analytical models; Application software; Contacts; Deformable models; Geometry; Micromechanical devices; Physics; Reverse engineering; Solid modeling; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location
Freiburg im Breisgau
Print_ISBN
978-1-4244-2127-5
Electronic_ISBN
978-1-4244-2128-2
Type
conf
DOI
10.1109/ESIME.2008.4525052
Filename
4525052
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