DocumentCode
3490308
Title
Minimum parasitic resistance for ultra-thin SOI MOSFET with high-permittivity gate insulator performed by lateral contact structure
Author
Shimada, H. ; Ohmi, T.
Author_Institution
Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan
fYear
1995
fDate
3-5 Oct 1995
Firstpage
98
Lastpage
99
Abstract
Since the interconnect capacitance almost maintains the same level even with shrinking device dimension, high current drive of a transistor is required for ultra-high speed operation. Although the ultra-thin SOI MOSFET is a promising candidate for ultra-small devices, its enormous parasitic resistance is a significant problem. The reduction of the parasitic resistance is a key issue in achieving high-performance ultra-thin SOI devices. In this study, a lateral contact structure, unique to SOI devices, with ultra-low contact resistance, is proposed for realizing ultimate low parasitic resistance
Keywords
MOSFET; contact resistance; permittivity; silicon-on-insulator; Si-Ta2O5; high-permittivity gate insulator; lateral contact structure; parasitic resistance; ultra-high speed operation; ultra-low contact resistance; ultra-thin SOI MOSFET; Contact resistance; Degradation; Insulation; MOSFET circuits; Maintenance engineering; Negative feedback; Parasitic capacitance; Surface resistance; Threshold voltage; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1995. Proceedings., 1995 IEEE International
Conference_Location
Tucson, AZ
Print_ISBN
0-7803-2547-8
Type
conf
DOI
10.1109/SOI.1995.526479
Filename
526479
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