DocumentCode
3490473
Title
Capture partial reluctance more efficiently for complex interconnect structure
Author
Du, Yu ; Liu, Deyan ; Dai, Wayne
Author_Institution
Sch. of Eng., Calfornia Univ., Santa Cruz, CA, USA
Volume
3
fYear
2004
fDate
6-11 June 2004
Firstpage
1389
Abstract
The partial reluctance based circuit analysis has been shown very efficient in capturing on-chip inductance effect because partial reluctance effect has much better locality than partial inductance. But efficient algorithms to extract sparse partial reluctance matrix for complex interconnect structure are needed. In this paper, the shielding effect of partial reluctance for general topology is illustrated and a 3-D extraction algorithm is developed to capture on-chip partial reluctance for multilayer complex interconnect structure. The partial reluctance estimation algorithm to estimate and truncate small mutual reluctance before extraction is developed to accelerate the partial reluctance extraction. The experimental results shows that our partial reluctance extraction approach is at least two orders of magnitude faster than inverting full partial inductance matrix but little accuracy is lost.
Keywords
electromagnetic induction; electromagnetic shielding; inductance; integrated circuit interconnections; magnetic fields; network analysis; 3D extraction algorithm; circuit analysis; complex interconnect structure; estimation algorithm; magnetic field; magnetic induction; multilayer structure; mutual reluctance; on-chip inductance effect; partial reluctance effect; shielding effect; sparse partial reluctance matrix; vector potential; Capacitance; Circuit analysis; Circuit simulation; Conductors; Coupling circuits; Current distribution; Inductance; Integrated circuit interconnections; Magnetic shielding; Sparse matrices;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2004 IEEE MTT-S International
ISSN
0149-645X
Print_ISBN
0-7803-8331-1
Type
conf
DOI
10.1109/MWSYM.2004.1338828
Filename
1338828
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