Title :
New method of dynamic compact thermal model extraction
Author :
Habra, W. ; Tounsi, P. ; Madrid, F. ; Dorkel, J.-M.
Abstract :
A compact thermal model extraction method for multi-chip power electronics systems is proposed. Innovative and accurate, it accounts for dynamic thermal coupling between multiple heat sources. The use of this model permits system designers to easily take into account transient electro-thermal coupling. The method is based on a definition of the optimal thermal coupling point, which is proven to be suitable even under transient conditions. Compared to the existing methods, the number of needed 3D thermal simulations or measurements for the model deduction is significantly reduced.
Keywords :
power integrated circuits; thermal analysis; dynamic compact thermal model extraction; dynamic thermal coupling; multichip power electronics systems; multiple heat sources; optimal thermal coupling; transient electrothermal coupling; Automotive applications; Automotive engineering; Design optimization; MOSFETs; Manufacturing; Power electronics; Power engineering and energy; Power system modeling; Temperature; Vehicle dynamics;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
DOI :
10.1109/ESIME.2008.4525070
