• DocumentCode
    3490569
  • Title

    The steady state damp heat test and dry heat test of plastic substrate based displays

  • Author

    Jian Zhong ; Ping Yang ; Jian-Ping Li ; Jun Zhou ; Quayle Chen ; Xu, Lie ; Salo, Ahti

  • Author_Institution
    Sch. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
  • fYear
    2008
  • fDate
    20-23 April 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The plastic substrate based display has many advantages in practical applications of electronics, such as portable, flexible, super thin etc. However, its reliability may significantly impact its performance under the specific environmental conditions. Among the environmental factors, the temperature and humidity are two of the most important factors which may affect the performance of the displays dramatically. In this study, to evaluate the reliability and adaptability under the high temperature and the high humidity, the new environmental testing process for the plastic substrate based displays is presented. It consists of the damp heat under steady state test and the dry heat test, together with visual inspections and electro-optical property measurement. Based on the test, the analysis and assessment of the reliability and adaptability of the plastic substrate based displays under high temperature and high humidity were further performed.
  • Keywords
    electro-optical devices; environmental testing; humidity; inspection; liquid crystal displays; plastics; reliability; adaptability evaluation; dry heat test; electro-optical property measurement; electronics; environmental testing process; humidity; liquid crystal display; plastic substrate based displays; reliability evaluation; steady state damp heat test; temperature; visual inspections; Displays; Environmental factors; Humidity; Inspection; Performance analysis; Performance evaluation; Plastics; Steady-state; Temperature; Testing; electro-optical property; environmental test; humidity; plastic substrate based display; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
  • Conference_Location
    Freiburg im Breisgau
  • Print_ISBN
    978-1-4244-2127-5
  • Type

    conf

  • DOI
    10.1109/ESIME.2008.4525073
  • Filename
    4525073