DocumentCode :
3490601
Title :
Fully depleted dual-gated thin-film SOI p-MOSFET with an isolated buried polysilicon backgate
Author :
Denton, P. ; Neudeck, G.W.
Author_Institution :
Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
1995
fDate :
3-5 Oct 1995
Firstpage :
135
Lastpage :
136
Abstract :
A p-channel Dual-Gated Thin-Film Silicon-on-insulator (DG-TFSOI) MOSFET has been fabricated with an isolated buried polysilicon backgate and is in a SOI island. This structure allows individual operation of each backgate of each device, rather than the present common backgate (substrate) structure. The ability to use a individual buried gate to dynamically shift the threshold voltage of each individual top MOSFET may have significant implications for low power circuits and offers a way to boost drive currents for faster switching. By using Epitaxial Lateral Overgrowth (ELO) the bottom thermal buried oxide can be specified to any thickness
Keywords :
MOSFET; buried layers; silicon; silicon-on-insulator; thin film transistors; ELO; Si-SiO2; dual-gated structure; epitaxial lateral overgrowth; fully depleted SOI MOSFET; isolated buried polysilicon backgate; low power circuits; p-channel device; thermal buried oxide; thin-film SOI p-MOSFET; threshold voltage shifting; Density measurement; Fabrication; MOSFET circuits; Oxidation; Silicon; Substrates; Thickness control; Threshold voltage; Transconductance; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1995. Proceedings., 1995 IEEE International
Conference_Location :
Tucson, AZ
Print_ISBN :
0-7803-2547-8
Type :
conf
DOI :
10.1109/SOI.1995.526497
Filename :
526497
Link To Document :
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