• DocumentCode
    3490692
  • Title

    Fluid-electrostatic-mechanical modeling of the dynamic response of RF-MEMS capacitive switches

  • Author

    Bielen, Jeroen ; Stulemeijer, Jiri ; Ganjoo, Deepak ; Ostergaard, Dale ; Noijen, Sander

  • Author_Institution
    Innovation Centre for RF, Nijmegen
  • fYear
    2008
  • fDate
    20-23 April 2008
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    For predicting dynamic responses of electrostatically actuated RF-MEMS it is imperative to be able to include fluid squeeze film effects (air damping) in a directly coupled electrostatic-mechanical model, in an efficient and accurate way. This paper presents the modeling methodology to predict the dynamic response of a capacitive RF-MEMS obtained with implementation of a isothermal non-linear compressible Reynolds equation in a directly coupled fluid-structural element in a pre-release of the Ansys FE software. Multi-physics simulations of harmonic (AC) responses and transient switching cycles, in which the switch closes and non-linear contact is included, were validated with measurements. It is concluded that the presented multi-physics model is a powerful tool for virtual device design and indispensable for predicting functional performance of RF-MEMS. This model provides more accurate transient results than models based on the linearized Reynolds equations.
  • Keywords
    dynamic response; harmonics; microswitches; transient analysis; Ansys FE software; RF-MEMS capacitive switches; air damping; coupled electrostatic-mechanical model; coupled fluid-structural element; dynamic response prediction; electrostatically actuated RF-MEMS; fluid squeeze film effects; fluid-electrostatic-mechanical modeling; harmonic responses; isothermal nonlinear compressible Reynolds equation; multiphysics simulations; nonlinear contact; transient switching; virtual device design; Capacitance; Damping; Electrodes; Electrostatics; Fluid dynamics; Nonlinear equations; Predictive models; Radio frequency; Radiofrequency microelectromechanical systems; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
  • Conference_Location
    Freiburg im Breisgau
  • Print_ISBN
    978-1-4244-2127-5
  • Electronic_ISBN
    978-1-4244-2128-2
  • Type

    conf

  • DOI
    10.1109/ESIME.2008.4525083
  • Filename
    4525083