Intrinsic dissipation in microelectromechanical systems

Author

Ardito, Raffaele ; Comi, Claudia ; Corigliano, Alberto ; Frangi, Attilio

Author_Institution

Dept. of Struct. Eng., Tech. Univ. (Politec.) of Milan, Milan

fYear

2008

fDate

20-23 April 2008

Firstpage

1

Lastpage

8

Abstract

The numerical evaluation of intrinsic dissipation induced by thermoelastic coupling is of paramount importance in microelectromechanical systems. This paper presents a finite-element based procedure for the computation of thermoelastic dissipation in microdevices. In case of ultrathin resonators, the experiments show that damping is strongly influenced by size-dependent phenomena. In order to simulate the scale dependence of dissipation, an enhanced nonlocal coupled thermoelastic model is introduced and the first results are discussed.

Keywords

damping; micromechanical devices; resonators; thermoelasticity; damping; finite-element based procedure; intrinsic dissipation; microdevices; microelectromechanical systems; nonlocal coupled thermoelastic model; numerical evaluation; thermoelastic coupling; thermoelastic dissipation; ultrathin resonators; Damping; Finite element methods; Mechanical sensors; Microelectromechanical systems; Micromechanical devices; Q factor; Resonant frequency; Sensor phenomena and characterization; Solids; Thermoelasticity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on

Conference_Location

Freiburg im Breisgau

Print_ISBN

978-1-4244-2127-5

Electronic_ISBN

978-1-4244-2128-2

Type

conf

DOI

10.1109/ESIME.2008.4525084

Filename

4525084