DocumentCode
3491010
Title
A new parameter for the prediction of deterioration in epoxy ground wall insulation
Author
Kim, Y.J. ; Nelson, J.K.
Author_Institution
Korea Electrotech. Res. Inst., Kyong Nam, South Korea
fYear
1988
fDate
16-20 Oct 1988
Firstpage
122
Lastpage
127
Abstract
A new partial discharge parameter, dynamic stagnation voltage, which is independent of voltage and polarity, is found to be a useful diagnostic measure in predicting remaining life and assessing insulation health. Twelve stator bars were taped with nine half flap layers of resin-rich press-curable mica-tape. Six examples were electrically stressed and three samples were subjected to combined thermal and electrical stresses. It is shown that the original electrical strength of epoxy-mica insulation can be interpreted in terms of this parameter, I t. For new insulation, I t=40 kV is assumed to be normal for this geometry and formulation. Insulation with I t=20 kV has a tree channel which extends to the middle of the ground insulation. Generally, large-area delamination appears, which is verified by tear-down analysis. I t<15 kV appears to be the critical value for insulation failure, since it is estimated that less than 1/2 of the insulation layer remains undeteriorated
Keywords
electric strength; fault location; insulation testing; partial discharges; 15 kV; 20 kV; 40 kV; combined thermal and electrical stresses; dynamic stagnation voltage; electrical strength; epoxy ground wall insulation; epoxy-mica insulation; insulation failure; insulation health; large-area delamination; partial discharge parameter; prediction of deterioration; remaining life; resin-rich press-curable mica-tape; tear-down analysis; Delamination; Dielectrics and electrical insulation; Failure analysis; Geometry; Partial discharge measurement; Partial discharges; Stator bars; Thermal stresses; Trees - insulation; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 1988. Annual Report., Conference on
Conference_Location
Ottawa, Ont.
Type
conf
DOI
10.1109/CEIDP.1988.26319
Filename
26319
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