DocumentCode
3491158
Title
Simulation of the fluid dynamics in active liquid heat sink for CPU cooling system
Author
Wang, Song-Hao ; Melendez, Steven ; Blanco, Ronny ; Gomez, Milton
Author_Institution
Micro & Precision Manuf. Center, Kun-Shan Univ. of Technol., Taipei
fYear
2008
fDate
20-23 April 2008
Firstpage
1
Lastpage
8
Abstract
This study numerically investigates the fluid dynamics in an active-liquid-heat-sink (ALHS) for a computer microprocessor cooling system. Principal concepts, basic design, and the integration of the ALHS technology into an internal CPU liquid cooling system are presented. Basic assumptions and numerical methods, especially for rotating machinery in fluid dynamics in the numerical simulation, are discussed in detail. From the numerical simulation, the stirring effect by the impeller on the velocity field is quite significant. The maximum velocity, which occurs in the vicinity of the impeller, is shown to be much larger than the average velocity. Since convective heat transfer is largely dependent on liquid velocity, higher cooling efficiency is expected; especially in the neighborhood of the impeller which could be located on top of the CPU heat source. Throughout the simulation, various impeller geometries were investigated, focusing on straight and curved leaves. The results indicated a higher flow rate with curved leaves, making their use favorable. Also, the simulation revealed that as the impeller rpm increases, both the velocity and the flow rate increase almost linearly. This result proves very useful for designing and optimizing of the cooling system.
Keywords
computational fluid dynamics; cooling; heat sinks; microprocessor chips; numerical analysis; CPU cooling system; active liquid heat sink; computer microprocessor cooling system; fluid dynamics simulation; internal CPU liquid cooling system; liquid velocity; numerical methods; numerical simulation; Computational modeling; Fluid dynamics; Heat sinks; Heat transfer; Impellers; Liquid cooling; Machinery; Microprocessors; Numerical simulation; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location
Freiburg im Breisgau
Print_ISBN
978-1-4244-2127-5
Electronic_ISBN
978-1-4244-2128-2
Type
conf
DOI
10.1109/ESIME.2008.4525111
Filename
4525111
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