DocumentCode
3491205
Title
Fabrication and testing of 980nm high-power VCSEL with AlN film passivation layer
Author
Hou, Lifeng ; Ma, Yongfeng ; Feng, Yuan
Author_Institution
Dept. of Electron. Eng., Changchun Eng. Tech. Inst. Changchun, Changchun, China
fYear
2012
fDate
23-25 Aug. 2012
Firstpage
45
Lastpage
48
Abstract
We report the fabrication and the testing of a novel high-power VCSEL with AlN film passivation layer in this paper. The analysis on the high-power VCSEL show that the AlN film passivation layer can improve the opto-electric characteristics of high-power VCSEL, reduce the thermal resistance of VCSEL and enhance the ability of the heat dissipation; The AlN film passivation layer and the SiO2 film passivation layer high-power VCSEL both with the same aperture have been made by the same processes on the same epitaxial wafer; the two kinds of high power VCSEL have been tested comparatively, the testing results show that the out power of the VCSEL on AlN film passivation layer is 470mW at room temperature, its characteristic temperature is 120K, it have the much better temperature and opto-electric characteristics than the device on the SiO2 film passivation layer.
Keywords
III-V semiconductors; aluminium compounds; cooling; laser beams; laser cavity resonators; optical fabrication; optical testing; passivation; quantum well lasers; semiconductor epitaxial layers; silicon compounds; surface emitting lasers; thermal resistance; wide band gap semiconductors; AlN; SiO2; characteristic temperature; epitaxial wafer; film passivation layer; heat dissipation; high-power VCSEL; laser out power; optical fabrication; optical testing; opto-electric characteristics; power 470 mW; temperature 120 K; temperature 293 K to 298 K; thermal resistance; wavelength 980 nm; Conductivity; Films; Heating; Passivation; Temperature; Threshold current; Vertical cavity surface emitting lasers; AIN; VCSEL; high-power; passivation layer; semiconductorlaser;
fLanguage
English
Publisher
ieee
Conference_Titel
Optoelectronics and Microelectronics (ICOM), 2012 International Conference on
Conference_Location
Changchun, Jilin
Print_ISBN
978-1-4673-2638-4
Type
conf
DOI
10.1109/ICoOM.2012.6316212
Filename
6316212
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