Non-contact probing of integrated circuits and packages

Author

Bridges, G.E.

Author_Institution

Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada

Volume

3

fYear

2004

fDate

6-11 June 2004

Firstpage

1805

Abstract

We report a non-contact probing technique capable of internal vector-voltage measurement of mm-wave ICs and package interconnects. Using a micro-fabricated probe, localized voltage amplitude and phase measurements can be made with a micrometer spatial resolution and without depassivation of the DUT test points. A probe with a bandwidth >30GHz, <10mV amplitude and <2° phase resolution, and with <10fF loading is demonstrated.

Keywords

integrated circuit interconnections; integrated circuit measurement; integrated circuit testing; microwave measurement; millimetre wave integrated circuits; probes; DUT test points; integrated circuit measurement; integrated circuits; internal vector-voltage measurement; localized voltage amplitude; microfabricated probe; micrometer spatial resolution; microwave measurement; mm-wave integrated circuit; noncontact probing; package interconnects; phase measurements; phase resolution; Bandwidth; Circuit testing; Frequency; Integrated circuit measurements; Integrated circuit packaging; Integrated circuit testing; Optical beams; Scanning probe microscopy; Spatial resolution; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2004 IEEE MTT-S International

ISSN

0149-645X

Print_ISBN

0-7803-8331-1

Type

conf

DOI

10.1109/MWSYM.2004.1338953

Filename

1338953