Title :
Packaging technology of 32-ch high-speed optical wavelength selector using PLC platform
Author :
Ogawa, Ikuo ; Suzaki, Yasumasa
Author_Institution :
NTT Photon. Labs., Ibaraki, Japan
Abstract :
We describe the packaging technology of a 32-ch high-speed optical wavelength selector module, which is a good example of a large scale integrated module. The present hybrid integration technology using a PLC platform is expected to realize a wide range of functional optical modules and contribute to the construction of future photonic networks
Keywords :
integrated circuit packaging; integrated optoelectronics; modules; optical communication equipment; 32-ch high-speed optical wavelength selector; PLC platform; functional optical modules; hybrid integration technology; large scale integrated module; packaging technology; photonic networks; Extinction ratio; High speed optical techniques; Integrated optics; Optical packet switching; Optical signal processing; Optical waveguides; Packaging; Programmable control; Semiconductor optical amplifiers; Stimulated emission;
Conference_Titel :
LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5634-9
DOI :
10.1109/LEOS.1999.813460
