550V SiP Compact Fluorescent Lamp Ballast IC

Author

Jong Tae Hwang ; Dae Ho Kim ; Moon Sang Jung ; Dong Hwan Kim

Author_Institution

Power Conversion Team, Fairchild Semicond., Gyeonggi-do

fYear

2006

fDate

Sept. 2006

Firstpage

576

Lastpage

579

Abstract

A ballast IC, which has a system-in-package (SiP) concept is designed using Fairchild´s high voltage BCDMOS processes. The ballast control IC, which includes 625V high-side gate driver circuit and two 550V MOSFETs are integrated in low cost 8DIP package. The proposed IC provides lamp preheating and ignition functions to increase the lamp lifetime. Also, to increase the inverter efficiency, an active ZVS operation is incorporated. The proposed IC can drive up to 20W CFL with 90% efficiency at 310V DC link voltage

Keywords

BIMOS integrated circuits; MOSFET circuits; driver circuits; fluorescent lamps; lamp accessories; system-in-package; zero voltage switching; 310 V; 550 V; 625 V; 8DIP package; MOSFET; SiP concept; active ZVS operation; ballast control IC; fluorescent lamp ballast IC; high voltage BCDMOS processes; high-side gate driver circuit; lamp ignition functions; lamp preheating functions; system-in-package concept; Costs; Driver circuits; Electronic ballasts; Fluorescent lamps; Ignition; Integrated circuit packaging; Inverters; MOSFETs; Process control; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2006. ESSCIRC 2006. Proceedings of the 32nd European

Conference_Location

Montreux

ISSN

1930-8833

Print_ISBN

1-4244-0303-0

Type

conf

DOI

10.1109/ESSCIR.2006.307490

Filename

4099832