Optoelectronic chip on film (OE-COF) packaging technology

Author

Takahara, Hideyuki ; Koshoubu, Nobutatsu ; Hirata, Hirooki ; Ishizawa, Suzuko ; Ishibashi, Shigeki ; Tsunetsugu, Hideki

Author_Institution

NTT Telecommun. Energy Labs., Tokyo, Japan

Volume

1

fYear

1999

fDate

1999

Firstpage

92

Abstract

The concept of optoelectronic chip on film (OE-COF) packaging is illustrated. An OE film consists of an optical waveguide film on which impedance-matched electrical line anti bump-bonding pads are formed. LSIs and optical devices such as VCSELs and photodiodes are flip-chip bonded onto the OE film using microsolder bumps

Keywords

flip-chip devices; impedance matching; integrated circuit packaging; integrated optoelectronics; optical fabrication; optical films; photodiodes; surface emitting lasers; LSIs; VCSELs; anti bump-bonding pads; flip-chip bonded; impedance-matched electrical lines; microsolder bumps; optical devices; optical waveguide film; optoelectronic chip on film packaging technology; photodiodes; Bonding; High speed optical techniques; Optical devices; Optical films; Optical interconnections; Optical refraction; Optical variables control; Optical waveguides; Packaging; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting

Conference_Location

San Francisco, CA

ISSN

1092-8081

Print_ISBN

0-7803-5634-9

Type

conf

DOI

10.1109/LEOS.1999.813492

Filename

813492