Task scheduling control of BGA solder joint process in flexible manufacturing system

Author

Alonge, F. ; Ippolito, F.D. ; Raimondi, F.M. ; Aiello, V.

Author_Institution

Dipt. di Ingegneria dell´´Automazione e del Sistemi, Univ. of Palermo Viale delle Sci.

Volume

2

fYear

2005

fDate

19-22 Sept. 2005

Lastpage

178

Abstract

This paper describes an open loop control method of the solder joint process in a rework station for faulty printed circuit board (PCBs) containing electronic components in packages ball grid arrays (BGAs). In particular, a mathematical model describing the solder joint process is, first of all, obtained. Then, the desired thermal profile of the junctions BGA-PCB is determined according to the physical constraints of the rework station framework. The control parameters corresponding to the above desired thermal profile are identified using the above mathematical model. Finally, the open loop control algorithm is implemented on the supervisor interface of the rework station in order to carried out experimental validation of the proposed method

Keywords

ball grid arrays; flexible manufacturing systems; open loop systems; printed circuits; scheduling; solders; BGA; BGA solder joint process; BGA-PCB; PCB; ball grid arrays; control parameter; electronic component; flexible manufacturing system; mathematical model; open loop control method; printed circuit board; rework station framework; task scheduling control; Circuit faults; Control systems; Electronic components; Electronic packaging thermal management; Flexible manufacturing systems; Flexible printed circuits; Job shop scheduling; Mathematical model; Open loop systems; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Emerging Technologies and Factory Automation, 2005. ETFA 2005. 10th IEEE Conference on

Conference_Location

Catania

Print_ISBN

0-7803-9401-1

Type

conf

DOI

10.1109/ETFA.2005.1612677

Filename

1612677