DocumentCode
3493020
Title
The study of EMI for antenna-in-package
Author
Zhang, Wenmei ; Zhang, Yueping
Author_Institution
Shanxi Univ., Taiyuan
fYear
2008
fDate
16-20 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
In this paper, the EMI for AiP is studied. The simulated results indicate the package will influence the performance of antenna, especially, when the ground for antenna, package and system is connected and feed from system board. At the same time, the radiation of antenna will induced the EF in packaged components and bonding trace and the MS line with different load has different response. In order to lessen the effect to packaged component from antenna, the guarding ring and vias fence are used, and the simulated results verify its validity.
Keywords
antenna feeds; antenna radiation patterns; electromagnetic interference; packaging; EMI study; antenna feed; antenna performance; antenna radiation; antenna-in-package; guarding ring; packaged component; Antenna accessories; Antenna feeds; Antenna radiation patterns; Bonding; Dielectric substrates; Electromagnetic interference; Impedance; Loaded antennas; Microstrip antennas; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location
Macau
Print_ISBN
978-1-4244-2641-6
Electronic_ISBN
978-1-4244-2642-3
Type
conf
DOI
10.1109/APMC.2008.4958644
Filename
4958644
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