DocumentCode
3493136
Title
Development of electromagnetic wave absorbers to improve ETC communication environment
Author
Park, Soo Hoon ; Kim, Dong Il ; Kang, Suk Youb
Author_Institution
Dept. of Radio Sci. & Eng., Korea Maritime Univ., Busan
fYear
2008
fDate
16-20 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
In this paper, we investigated EM wave absorber for a ceiling of a tollgate in ETC system. The EM wave absorber samples were made of CPE and Flake Sendust powders, which can be manufactured with mechanical forging of spherical Sendust powders using attrition mill to get high value of magnetic permeability and dielectric permittivity in high frequency range. The absorption ability of the samples were measured by vector network analyzer. We compared the absorption abilities of the samples. These material constants were calculated from the S-parameter. EM wave absorber is designed by using material property and variation of thickness at 5.8 GHz. The optimized composition ratio of absorbing materials was Flake Sendust powders: CPE = 62.5 : 37.5 wt.%, and absorption ability of the EM wave absorber with thickness of 2.85 mm showed more than 20 dB at 5.8 GHz. Therefore, it is expected that the newly developed absorber can be used for countermeasure against EMI from a ceiling of a tollgate in ETC system.
Keywords
S-parameters; electromagnetic interference; electromagnetic wave absorption; network analysers; permittivity; EMI; ETC communication environment; Flake Sendust powders; S-parameter; dielectric permittivity; electromagnetic wave absorbers; frequency 5.8 GHz; magnetic permeability; material property; spherical Sendust powders; variation of thickness; vector network analyzer; Absorption; Dielectric measurements; Electromagnetic scattering; Frequency; Magnetic analysis; Manufacturing; Milling machines; Permeability; Permittivity measurement; Powders;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location
Macau
Print_ISBN
978-1-4244-2641-6
Electronic_ISBN
978-1-4244-2642-3
Type
conf
DOI
10.1109/APMC.2008.4958650
Filename
4958650
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