• DocumentCode
    3493136
  • Title

    Development of electromagnetic wave absorbers to improve ETC communication environment

  • Author

    Park, Soo Hoon ; Kim, Dong Il ; Kang, Suk Youb

  • Author_Institution
    Dept. of Radio Sci. & Eng., Korea Maritime Univ., Busan
  • fYear
    2008
  • fDate
    16-20 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we investigated EM wave absorber for a ceiling of a tollgate in ETC system. The EM wave absorber samples were made of CPE and Flake Sendust powders, which can be manufactured with mechanical forging of spherical Sendust powders using attrition mill to get high value of magnetic permeability and dielectric permittivity in high frequency range. The absorption ability of the samples were measured by vector network analyzer. We compared the absorption abilities of the samples. These material constants were calculated from the S-parameter. EM wave absorber is designed by using material property and variation of thickness at 5.8 GHz. The optimized composition ratio of absorbing materials was Flake Sendust powders: CPE = 62.5 : 37.5 wt.%, and absorption ability of the EM wave absorber with thickness of 2.85 mm showed more than 20 dB at 5.8 GHz. Therefore, it is expected that the newly developed absorber can be used for countermeasure against EMI from a ceiling of a tollgate in ETC system.
  • Keywords
    S-parameters; electromagnetic interference; electromagnetic wave absorption; network analysers; permittivity; EMI; ETC communication environment; Flake Sendust powders; S-parameter; dielectric permittivity; electromagnetic wave absorbers; frequency 5.8 GHz; magnetic permeability; material property; spherical Sendust powders; variation of thickness; vector network analyzer; Absorption; Dielectric measurements; Electromagnetic scattering; Frequency; Magnetic analysis; Manufacturing; Milling machines; Permeability; Permittivity measurement; Powders;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008. APMC 2008. Asia-Pacific
  • Conference_Location
    Macau
  • Print_ISBN
    978-1-4244-2641-6
  • Electronic_ISBN
    978-1-4244-2642-3
  • Type

    conf

  • DOI
    10.1109/APMC.2008.4958650
  • Filename
    4958650