Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
Abstract :
Compactness, modularity, programming or learning capability, energy efficiency, and robustness are key features needed in next-generation optoelectronic signal processors. Then and only then will these processors make a commercial impact. Neural network architectures have been given the most attention thus far, so the focus here will be mainly on this family of processors. Advances in the development of next-generation optoelectronic signal processors will continue to be stimulated by the on-going commercial revolution in high-resolution microdisplays and GaAs integrated-circuit technologies. To achieve the desired compactness, the next-generation systems will most likely have to employ light detection, electronic processing and light generation on the same chip. Architectures requiring off-chip sources are not recommended, as these generally require the use of beam splitters, and so are never optimal in terms of compactness and modularity. The purpose here is to encourage development of: (a) cascadable, optoelectronic integrated-circuit arrays (smart-pixels) that employ light detection, electronic processing and light emission on the same chip, (b) compatible, reconfigurable optical interconnection devices, and (c) integration of these elements into compact, modular signal-processing systems
Keywords :
integrated optoelectronics; neural chips; optical interconnections; optical neural nets; smart pixels; spatial light modulators; cascadable arrays; compact optoelectronic signal processors; microdisplay SLM; modular signal-processing systems; multilevel processors; next-generation devices; optical neural network architectures; packaging; programmable interconnections; reconfigurable optical interconnection devices; smart-pixels; Circuits; Gallium arsenide; Liquid crystal devices; Neurons; Optical computing; Optical network units; Optical sensors; Optical signal processing; Signal processing; Very large scale integration;