DocumentCode
349454
Title
Peculiarities of implantation of silicon with intensive beams of B + and BF2+ ions
Author
Troitski, V.Yu. ; Gerasimenko, N.N. ; Verner, I.V.
Author_Institution
Res. Dev. & Production Center ORION, Moscow, Russia
Volume
2
fYear
1999
fDate
36495
Firstpage
849
Abstract
The comparison of results on implantation of B+ ions and molecular ions BF2+ into silicon at density of ion beam current (j) up to 120 μA cm-2 has been conducted. The investigation of the kinetics of changes in structure of implanted layers, profiles of distribution of introduced impurities and degree of electrical activation of boron atoms showed that only molecular ions stimulate sufficient dynamic processes during irradiation. This dynamic process causes electrical activation of boron and the shift of its distribution profile towards the surface
Keywords
boron; boron compounds; doping profiles; elemental semiconductors; impurity states; ion implantation; semiconductor doping; silicon; B+; BF2+ ions; Si:B; Si:BF2; distribution profile; dynamic processes; electrical activation; implantation; impurities; intensive beams; ion beam current; kinetics; molecular ions; profiles; silicon; Annealing; Atomic layer deposition; Boron; Crystallization; Electrical resistance measurement; Impurities; Ion beams; Production; Silicon; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-7803-4538-X
Type
conf
DOI
10.1109/IIT.1998.813801
Filename
813801
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