DocumentCode
3494605
Title
Heat transfer analysis of micromachined thermal conductivity sensors
Author
Beigelbeck, Roman ; Kohl, Franz ; Kuntner, Jochen ; Jakoby, Bernhard
Author_Institution
Res. Unit for Integrated Sensor Syst., Austrian Acad. of Sci., Wiener Neustadt
Volume
2
fYear
2005
fDate
19-22 Sept. 2005
Lastpage
983
Abstract
Due to unique features, micromachined thermal sensors are an interesting alternative to classical macroscopic apparatuses for the determination of thermal conductivities. A typical drawback of sophisticated miniaturized sensing elements is the fact that for most devices no analytical solution of the heat conduction equation can be obtained and thus a numerical model has to be implemented to determine the thermal parameter(s) of interest. In this contribution, an analytical model of a micromachined sensor for measuring the thermal conductivity and diffusivity of different liquids is presented. The model not only accounts for the unique sensor geometry but also for additional spurious effects associated with the devices membrane
Keywords
diffusion; heat conduction; microsensors; thermal conductivity; thermal conductivity measurement; diffusivity; heat conduction equation; heat transfer analysis; micromachined thermal conductivity sensors; Analytical models; Conductivity measurement; Equations; Heat transfer; Liquids; Numerical models; Sensor phenomena and characterization; Solid modeling; Thermal conductivity; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Technologies and Factory Automation, 2005. ETFA 2005. 10th IEEE Conference on
Conference_Location
Catania
Print_ISBN
0-7803-9401-1
Type
conf
DOI
10.1109/ETFA.2005.1612778
Filename
1612778
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