• DocumentCode
    3494605
  • Title

    Heat transfer analysis of micromachined thermal conductivity sensors

  • Author

    Beigelbeck, Roman ; Kohl, Franz ; Kuntner, Jochen ; Jakoby, Bernhard

  • Author_Institution
    Res. Unit for Integrated Sensor Syst., Austrian Acad. of Sci., Wiener Neustadt
  • Volume
    2
  • fYear
    2005
  • fDate
    19-22 Sept. 2005
  • Lastpage
    983
  • Abstract
    Due to unique features, micromachined thermal sensors are an interesting alternative to classical macroscopic apparatuses for the determination of thermal conductivities. A typical drawback of sophisticated miniaturized sensing elements is the fact that for most devices no analytical solution of the heat conduction equation can be obtained and thus a numerical model has to be implemented to determine the thermal parameter(s) of interest. In this contribution, an analytical model of a micromachined sensor for measuring the thermal conductivity and diffusivity of different liquids is presented. The model not only accounts for the unique sensor geometry but also for additional spurious effects associated with the devices membrane
  • Keywords
    diffusion; heat conduction; microsensors; thermal conductivity; thermal conductivity measurement; diffusivity; heat conduction equation; heat transfer analysis; micromachined thermal conductivity sensors; Analytical models; Conductivity measurement; Equations; Heat transfer; Liquids; Numerical models; Sensor phenomena and characterization; Solid modeling; Thermal conductivity; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Technologies and Factory Automation, 2005. ETFA 2005. 10th IEEE Conference on
  • Conference_Location
    Catania
  • Print_ISBN
    0-7803-9401-1
  • Type

    conf

  • DOI
    10.1109/ETFA.2005.1612778
  • Filename
    1612778