DocumentCode :
3494672
Title :
The growth of 3D VA-CNTs stacks by predefining multilayered Al/Fe catalyst films for MEMS fabrication
Author :
Hu, C.-F. ; Cheng, C.-L. ; Fang, Wanliang
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2013
fDate :
20-24 Jan. 2013
Firstpage :
82
Lastpage :
85
Abstract :
This study presents a novel approach to fabricate highly-structured 3D vertically-aligned carbon nanotubes (VA-CNTs) architectures, and further integrates 3D VA-CNTs with MEMS surface micromachining to fabricate suspended 3D CNTs structures. The merits of presented approach are as follows: (1) highly-structured 3D VA-CNTs stacks can be achieved by predefining multilayered Al/Fe catalyst films; (2) only single run of the pyrolysis CVD process is required to grow multilayered 3D VA-CNTs stacks; (3) the design flexibility of the microstructure in out-of-plane direction can be increased by the variation layers of CNTs stacks. Preliminary fabrication results implement various 3D VA-CNTs architectures. Furthermore, 3D CNTs stacks have been integrated with MEMS surface micromachining to demonstrate different thickness of 3D CNTs suspended cantilevers and probe. The out-of-plane resonant frequency has also been calibrated to characterize different stiffness of the 3D CNTs suspended devices.
Keywords :
aluminium; cantilevers; carbon nanotubes; catalysts; iron; micromachining; multilayers; nanofabrication; 3D CNT suspended cantilever thickness; 3D VA-CNT stack growth; Al-Fe; MEMS fabrication; MEMS surface micromachining; VA-CNT architecture fabrication; highly-structured 3D vertically-aligned carbon nanotube architecture fabrication; microstructure design flexibility; out-of-plane resonant frequency; predefining multilayered catalyst films; probe; pyrolysis CVD process; suspended 3D CNT structure fabrication; Carbon nanotubes; Fabrication; Films; Iron; Micromachining; Micromechanical devices; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
ISSN :
1084-6999
Print_ISBN :
978-1-4673-5654-1
Type :
conf
DOI :
10.1109/MEMSYS.2013.6474182
Filename :
6474182
Link To Document :
بازگشت