Experimental and simulation analysis of single and differential signals changing layers

Author

Norman, Adam J. ; Schaffer, Mike ; Chen, Juan ; Ilavarasan, Ponniah

Author_Institution

Intel Corp., USA

Volume

2

fYear

2001

fDate

2001

Firstpage

1088

Abstract

The physical effects surrounding the transition of a signal trace from one layer to another in a PCB design is studied both experimentally and numerically. This fundamental understanding is central to motherboard designs that are free from signal integrity and EMC/EMI deficiencies. The effects due to return current path discontinuities, current coupling, trace coupling and reference plane are considered. The results are interpreted from both a signal integrity (flight times and signal quality) and EMC/EMI standpoints. The findings will help drive better design practices into the PCB world

Keywords

electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; printed circuit design; EMC deficiencies; EMI deficiencies; PCB design; current coupling; differential signals; reference plane; return current path discontinuities; signal integrity; signal transition; single signals; trace coupling; Analytical models; Capacitors; Electromagnetic compatibility; Electromagnetic interference; Power transmission lines; Routing; Signal analysis; Signal design; Solid modeling; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

0-7803-6569-0

Type

conf

DOI

10.1109/ISEMC.2001.950563

Filename

950563