Weakness of the TEM cell method in evaluating IC radiated emissions

Author

Fiori, Franco ; Musolino, Francesco ; Pozzolo, Vincenzo

Author_Institution

Dipt. di Elettronica, Politecnico di Torino, Italy

Volume

1

fYear

2001

fDate

2001

Firstpage

135

Abstract

This paper deals with the characterization of integrated circuits (ICs) in terms of electromagnetic emissions. IC operations excite direct radiation by package lead frame and bonding interconnections which behave like magnetic and electric dipoles. Using the TEM cell method, some of these antennas are not coupled with the TEM mode of the cell hence, these contributions are not taken into account. In this work, limitations of the TEM cell method are pointed out. In particular, it is shown that the TEM cell method underestimates the direct radiated emissions of the ICs. This fact has been validated by performing IC direct radiated emissions measurements in an anechoic chamber

Keywords

electric field measurement; electromagnetic interference; integrated circuit testing; magnetic field measurement; test facilities; 30 MHz to 1 GHz; IC current paths; IC radiated emissions evaluation; TEM cell method; anechoic chamber; antennas; bonding interconnections; direct radiation; electric dipoles; electromagnetic emissions; integrated circuits; magnetic dipoles; package lead frame; Bonding; Clocks; Coupling circuits; Electromagnetic radiation; Integrated circuit interconnections; Integrated circuit packaging; Logic circuits; Pulse circuits; Silicon; TEM cells;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

0-7803-6569-0

Type

conf

DOI

10.1109/ISEMC.2001.950566

Filename

950566