• DocumentCode
    349495
  • Title

    The effect of ramp rate and annealing temperature on boron transient diffusion in implanted silicon: kinetic Monte Carlo simulations

  • Author

    Caturla, M.J. ; Foad, M. ; De La Rubia, T. Diaz

  • Author_Institution
    Lawrence Livermore Nat. Lab., CA, USA
  • Volume
    2
  • fYear
    1999
  • fDate
    36495
  • Firstpage
    1018
  • Abstract
    We present results of recent kinetic Monte Carlo simulations of the effect of annealing time and ramp rate on boron transient enhanced diffusion (BTED) in low energy ion implanted silicon. The simulations use a database of defect and dopant energetics derived from first principle calculations. We discuss the complete atomistic details of defect and dopant clustering during the anneals, and the dependence of boron TED on ramp rate. The simulations provide a complete time history of the evolution of the active boron fraction during the anneal for a wide variety of conditions. We also studied the lateral spreading of the boron during the annealing for two different conditions, furnace anneal and ramp anneal
  • Keywords
    Monte Carlo methods; annealing; boron; diffusion; elemental semiconductors; ion implantation; rapid thermal annealing; segregation; semiconductor doping; semiconductor process modelling; silicon; Si:B; annealing temperature; annealing time; boron transient diffusion; boron transient enhanced diffusion; defect energetics; dopant clustering; dopant energetics; first principle calculations; furnace anneal; implanted silicon; kinetic Monte Carlo simulations; lateral spreading; low energy ion implanted silicon; ramp anneal; ramp rate; Atomic measurements; Boron; Databases; Kinetic theory; Laboratories; Predictive models; Rapid thermal annealing; Silicon; Simulated annealing; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology Proceedings, 1998 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    0-7803-4538-X
  • Type

    conf

  • DOI
    10.1109/IIT.1998.813852
  • Filename
    813852