• DocumentCode
    3495073
  • Title

    Effect of thickness anisotropy on degenerate modes in oxide micro-hemispherical shell resonators

  • Author

    Sorenson, Logan D. ; Shao, Peng ; Ayazi, Farrokh

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    169
  • Lastpage
    172
  • Abstract
    The effect of thickness anisotropy on the degenerate elliptical resonance modes of micro-hemispherical shell resonators (μHSRs) created using the thermal oxidation process is investigated. This anisotropy arises from the variation in wet thermal oxide growth according to the exposed crystal planes of the single-crystal-silicon hemispherical mold used to generate the μHSRs. It is shown that, despite the presence of thickness anisotropy, the degenerate resonance modes of oxide μHSRs can exhibit zero intrinsic frequency split depending on the particular resonance mode and symmetry of the thickness anisotropy imparted from the underlying silicon wafer. Measured results verified by simultaneous electrical excitation on the 0° and 45° axes demonstrate less than 94 Hz intrinsic m=3 frequency split for a 1240 μm oxide μHSR (limited by measurement conditions), which is to the authors´ knowledge the smallest as-fabricated frequency split reported to date for any μHSR.
  • Keywords
    elemental semiconductors; microcavities; micromechanical resonators; oxidation; silicon; μHSR; Si; degenerate elliptical resonance modes; electrical excitation; exposed crystal planes; oxide microhemispherical shell resonators; silicon wafer; single-crystal-silicon hemispherical mold; size 1240 mum; thermal oxidation process; thickness anisotropy symmetry; wet thermal oxide growth; zero intrinsic frequency split; Anisotropic magnetoresistance; Crystals; Finite element methods; Geometry; Indexes; Resonant frequency; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474204
  • Filename
    6474204