DocumentCode
3495073
Title
Effect of thickness anisotropy on degenerate modes in oxide micro-hemispherical shell resonators
Author
Sorenson, Logan D. ; Shao, Peng ; Ayazi, Farrokh
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2013
fDate
20-24 Jan. 2013
Firstpage
169
Lastpage
172
Abstract
The effect of thickness anisotropy on the degenerate elliptical resonance modes of micro-hemispherical shell resonators (μHSRs) created using the thermal oxidation process is investigated. This anisotropy arises from the variation in wet thermal oxide growth according to the exposed crystal planes of the single-crystal-silicon hemispherical mold used to generate the μHSRs. It is shown that, despite the presence of thickness anisotropy, the degenerate resonance modes of oxide μHSRs can exhibit zero intrinsic frequency split depending on the particular resonance mode and symmetry of the thickness anisotropy imparted from the underlying silicon wafer. Measured results verified by simultaneous electrical excitation on the 0° and 45° axes demonstrate less than 94 Hz intrinsic m=3 frequency split for a 1240 μm oxide μHSR (limited by measurement conditions), which is to the authors´ knowledge the smallest as-fabricated frequency split reported to date for any μHSR.
Keywords
elemental semiconductors; microcavities; micromechanical resonators; oxidation; silicon; μHSR; Si; degenerate elliptical resonance modes; electrical excitation; exposed crystal planes; oxide microhemispherical shell resonators; silicon wafer; single-crystal-silicon hemispherical mold; size 1240 mum; thermal oxidation process; thickness anisotropy symmetry; wet thermal oxide growth; zero intrinsic frequency split; Anisotropic magnetoresistance; Crystals; Finite element methods; Geometry; Indexes; Resonant frequency; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location
Taipei
ISSN
1084-6999
Print_ISBN
978-1-4673-5654-1
Type
conf
DOI
10.1109/MEMSYS.2013.6474204
Filename
6474204
Link To Document