• DocumentCode
    3495099
  • Title

    Wire-Sizing for Interconnect Performance Optimization Considering High Inductance Effects

  • Author

    Ji, Xiaopeng ; Ge, Long ; Han, Xiaodong ; Wang, Zhiquan

  • Author_Institution
    Nanjing Univ. of Sci. & Technol., Nanjing
  • fYear
    2008
  • fDate
    6-8 April 2008
  • Firstpage
    1114
  • Lastpage
    1118
  • Abstract
    In this paper, we study wire width planning for interconnect performance optimization in an interconnect-centric design flow. We first present an equivalent Elmore delay metric for distributed parameter interconnect lines considering high inductance effects based on the two-pole approximation model, and then propose a simplified near-optimal uniform wire-sizing scheme. Based on the closed form delay metric, a delay-area tradeoff is proposed to interconnect optimizations, and the delay metric can be applied to other optimization problems in a similar way. Experimental results show that the method we proposed is of great accuracy and efficiency, and will be very useful for better design convergence and simpler routing architectures.
  • Keywords
    VLSI; approximation theory; integrated circuit design; equivalent Elmore delay metric; high inductance effects; interconnect performance optimization; interconnect-centric design flow; two-pole approximation model; wire width planning; wire-sizing; Capacitance; Delay effects; Inductance; Integrated circuit interconnections; Optimization; RLC circuits; Routing; Transfer functions; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Networking, Sensing and Control, 2008. ICNSC 2008. IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1685-1
  • Electronic_ISBN
    978-1-4244-1686-8
  • Type

    conf

  • DOI
    10.1109/ICNSC.2008.4525383
  • Filename
    4525383