DocumentCode
3495099
Title
Wire-Sizing for Interconnect Performance Optimization Considering High Inductance Effects
Author
Ji, Xiaopeng ; Ge, Long ; Han, Xiaodong ; Wang, Zhiquan
Author_Institution
Nanjing Univ. of Sci. & Technol., Nanjing
fYear
2008
fDate
6-8 April 2008
Firstpage
1114
Lastpage
1118
Abstract
In this paper, we study wire width planning for interconnect performance optimization in an interconnect-centric design flow. We first present an equivalent Elmore delay metric for distributed parameter interconnect lines considering high inductance effects based on the two-pole approximation model, and then propose a simplified near-optimal uniform wire-sizing scheme. Based on the closed form delay metric, a delay-area tradeoff is proposed to interconnect optimizations, and the delay metric can be applied to other optimization problems in a similar way. Experimental results show that the method we proposed is of great accuracy and efficiency, and will be very useful for better design convergence and simpler routing architectures.
Keywords
VLSI; approximation theory; integrated circuit design; equivalent Elmore delay metric; high inductance effects; interconnect performance optimization; interconnect-centric design flow; two-pole approximation model; wire width planning; wire-sizing; Capacitance; Delay effects; Inductance; Integrated circuit interconnections; Optimization; RLC circuits; Routing; Transfer functions; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Networking, Sensing and Control, 2008. ICNSC 2008. IEEE International Conference on
Conference_Location
Sanya
Print_ISBN
978-1-4244-1685-1
Electronic_ISBN
978-1-4244-1686-8
Type
conf
DOI
10.1109/ICNSC.2008.4525383
Filename
4525383
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