Micro-Einzel lens for wafer-integrated electron beam actuation

Miniaturizing charged particle beam actuator systems to the wafer-scale Si-based micromachined platforms, requires devices such as micro-Einzel lenses, which are used to control beam trajectory and focusing in targeted small volumes. In this paper, we present a highly versatile 3D fabrication process that provides high aspect ratio multi-electrode structures that enable electrostatic Einzel lenses, quadrupoles, and hexapoles, for in-plane and out-of-plane particle motion-control. We demonstrate 3 wafer-layer Einzel lens with predicted focal length shifts of up to 167mm for voltages up to 300V. This lens actuator technology paves the way for integrated charged particle beam systems such as parallel e-beam lithography that offers much faster writing times than conventional single-beam systems.