Title :
Microassembly of MEMS actuators and sensors via micro-masonry
Author :
Zhang, Ye ; Keum, Hohyun ; Kim, Sungho
Author_Institution :
Univ. of Illinois at Urbana-Champaign, Champaign, IL, USA
Abstract :
Micro-masonry is a microassembly technique that is based on transfer printing and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators based on this micro-masonry technique. Microfabrication processes for retrievable MEMS components (e.g., combs, flexure beams, and metal pads) are developed. As manipulation tools, elastomeric microtipped stamps with switchable dry adhesion are also designed and fabricated to pick up and place those components. After the assembly, the components are permanently bonded together via rapid thermal annealing. The sensing and actuating capabilities of the assembled MEMS devices are characterized.
Keywords :
bonding processes; microactuators; microassembling; microfabrication; microsensors; rapid thermal annealing; MEMS devices; MEMS mechanical actuators; MEMS mechanical sensors; direct bonding; elastomeric microtipped stamps; manipulation tool; microassembly technique; microfabrication process; micromasonry technique; rapid thermal annealing; retrievable MEMS components; switchable dry adhesion; transfer printing; Adhesives; Assembly; Fingers; Gold; Micromechanical devices; Resists; Substrates;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474233