Capturing via effects in simultaneous switching noise simulation

Author

Chun, Sungjun ; Choi, Jinseong ; Dalmia, Sidharth ; Kim, Woopoung ; Swaminathan, Madhavan

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

2

fYear

2001

fDate

2001

Firstpage

1221

Abstract

This paper presents a method for including via effects in modeling simultaneous switching noise (SSN). Models for interconnections and multi-layered planes have been developed and combined using superposition based on skin depth approximation to capture the return current effect due to via transitions. Measurements on active board containing the drivers, transmission lines, vias and planes have been conducted. The modeling approach has been correlated with measurements, showing the validity of the method. The modeling method has been extended and applied to large size systems to model the power supply fluctuations due to via transitions

Keywords

electromagnetic interference; interconnections; printed circuit testing; switching circuits; active board measurements; interconnections; multi-layered planes; power supply fluctuations; return current effect capture; simultaneous switching noise simulation; skin depth approximation; superposition; switching circuits; transmission lines; via effects capturing; via inductance; via transitions; Integrated circuit interconnections; Microstrip; Packaging; Power measurement; Power supplies; Power system modeling; Power transmission lines; Testing; Transmission line measurements; Vehicle driving;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

0-7803-6569-0

Type

conf

DOI

10.1109/ISEMC.2001.950609

Filename

950609